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Bibliographic Details
Main Authors: Schlosser, Tobias, Beuth, Frederik, Friedrich, Michael, Kowerko, Danny
Format: Preprint
Published: 2019
Subjects:
Online Access:https://arxiv.org/abs/1911.11250
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author Schlosser, Tobias
Beuth, Frederik
Friedrich, Michael
Kowerko, Danny
author_facet Schlosser, Tobias
Beuth, Frederik
Friedrich, Michael
Kowerko, Danny
contents Automated visual inspection in the semiconductor industry aims to detect and classify manufacturing defects utilizing modern image processing techniques. While an earliest possible detection of defect patterns allows quality control and automation of manufacturing chains, manufacturers benefit from an increased yield and reduced manufacturing costs. Since classical image processing systems are limited in their ability to detect novel defect patterns, and machine learning approaches often involve a tremendous amount of computational effort, this contribution introduces a novel deep neural network based hybrid approach. Unlike classical deep neural networks, a multi-stage system allows the detection and classification of the finest structures in pixel size within high-resolution imagery. Consisting of stacked hybrid convolutional neural networks (SH-CNN) and inspired by current approaches of visual attention, the realized system draws the focus over the level of detail from its structures to more task-relevant areas of interest. The results of our test environment show that the SH-CNN outperforms current approaches of learning-based automated visual inspection, whereas a distinction depending on the level of detail enables the elimination of defect patterns in earlier stages of the manufacturing process.
format Preprint
id arxiv_https___arxiv_org_abs_1911_11250
institution arXiv
publishDate 2019
record_format arxiv
spellingShingle A Novel Visual Fault Detection and Classification System for Semiconductor Manufacturing Using Stacked Hybrid Convolutional Neural Networks
Schlosser, Tobias
Beuth, Frederik
Friedrich, Michael
Kowerko, Danny
Machine Learning
Computer Vision and Pattern Recognition
Image and Video Processing
Automated visual inspection in the semiconductor industry aims to detect and classify manufacturing defects utilizing modern image processing techniques. While an earliest possible detection of defect patterns allows quality control and automation of manufacturing chains, manufacturers benefit from an increased yield and reduced manufacturing costs. Since classical image processing systems are limited in their ability to detect novel defect patterns, and machine learning approaches often involve a tremendous amount of computational effort, this contribution introduces a novel deep neural network based hybrid approach. Unlike classical deep neural networks, a multi-stage system allows the detection and classification of the finest structures in pixel size within high-resolution imagery. Consisting of stacked hybrid convolutional neural networks (SH-CNN) and inspired by current approaches of visual attention, the realized system draws the focus over the level of detail from its structures to more task-relevant areas of interest. The results of our test environment show that the SH-CNN outperforms current approaches of learning-based automated visual inspection, whereas a distinction depending on the level of detail enables the elimination of defect patterns in earlier stages of the manufacturing process.
title A Novel Visual Fault Detection and Classification System for Semiconductor Manufacturing Using Stacked Hybrid Convolutional Neural Networks
topic Machine Learning
Computer Vision and Pattern Recognition
Image and Video Processing
url https://arxiv.org/abs/1911.11250