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Main Authors: Wang, Yueping, An, Jongwon, Kim, Hongseok, Jeong, Sehui, Kim, Hyunggyu, Park, Jaesung, Ko, Seunggyu, Son, Jinho, Lee, Howon
Format: Preprint
Published: 2024
Subjects:
Soft Condensed Matter
Materials Science
Online Access:https://arxiv.org/abs/2401.06590
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