Cover Image

Saved in:
Bibliographic Details
Format: Revista científica
Language:ZH
Published: Shanghai Institute of Microsystem and Information Technology 2026
Subjects:
semiconductors
microelectronics
integrated circuits
materials science
devices
Materials of engineering and construction. Mechanics of materials
TA401-492
Online Access:https://doaj.org/toc/1007-4252
Tags: Add Tag
No Tags, Be the first to tag this record!

Similar Items

Similar Items