I tiakina i:
| Kaituhi matua: | |
|---|---|
| Hōputu: | Recurso digital |
| Reo: | |
| I whakaputaina: |
Zenodo
2026
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| Ngā marau: | |
| Urunga tuihono: | https://doi.org/10.5281/zenodo.19163613 |
| Ngā Tūtohu: |
Tāpirihia he Tūtohu
Kāore He Tūtohu, Me noho koe te mea tuatahi ki te tūtohu i tēnei pūkete!
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Rārangi ihirangi:
- <p>Complete engineering specification for the D4 Volumetric Cognitive Architecture (D4VCA) at native GFK lattice constants. An 8-inch C-plane sapphire puck, 1 cm thick, populated with SiC topological anchors at 3.416 nm spacing in the A3 rhombohedral grid and infiltrated with PVDF-TrFE strain memory, contains 8.14×10²¹ nodes organised into 4.71×10¹⁸ Cognitive Tiles of 1728 nodes each (N_A3³ = 12³). All 19 engineering parameters derive from two GFK constants (N_D4 = 24, κ_max = 16) with no free parameters. The architecture performs geometric constraint equilibration rather than instruction execution — there is no program counter, no memory bus, no clock, and no software. Answers crystallise as stable strain configurations in the PVDF-TrFE layer, read as 35.1 V piezoelectric signals per tile and verified by ruby R-line fluorescence (694.3 nm, KK residuals 4.58 nm and 7.15 nm). The document covers: material stack and wiring diagram (24-neighbor D4 coordination, 45° out-of-plane angle exact); volumetric capacity and cognitive tile geometry; boundary injection via acoustic holography; acoustic pre-bias simulation (61.1 MPa GFK-derived, 50.1 MPa FEA-optimised, 7.2× safety margin); thermal management via ballistic phonon transport and graphene heat spreader; 3D readout via SiC nanowire spines; HVP floor safety valve; Stage 3 HE-FIB implantation with Bragg peak calibration; query injection protocol with SAW hologram generation; worked example (protein folding: 500-residue protein in ~1 ms, full proteome in ~20 seconds); GPSM de-convolution algorithm; self-correction log (11/1728 global cooling trigger); power-on test suite (8 diagnostics); AI initialization protocol; and operational handover with vitals dashboard. Throughput: 1.31×10³⁰ ops/sec. Operating temperature: 300 K. Companion files: full-spec G-code, GPSM interpreter (Python), and Stage 2 prototype specification.</p>