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    Ultra‐Tough Copper–Copper Bonding by Nano‐Oxide‐Dispersed Copper Nanomembranes Autoría: Yun Teng, Wenqing Zhu, Qing Wang, Zhibo Zhang, Hang Wang, Baisong Guo, Ziyin Yang, Hao Gong, Chuan He, Boxi Qu, Shien‐Ping Feng, Yong Yang

    Published 2025
    Fuente: Wiley Open Access
    Tipo de material: Artículo Open Access
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