Search Results - Dohyun Go
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Chiplet Encapsulation and Planarization with 100 μm Deep Gaps Using AlN Powder Spray + Sputter Hybrid Deposition Autoría: Dohyun Go, Ashita Victor, Alex Wang, Mingeun Choi, Hyun Seok Song, Seong Uk Yun, Dipayan Pal, Ping‐Che Lee, Jit Dutta, Jungho Ryu, Satish Kumar, Carl V. Thompson, Muhannad S. Bakir, Andrew C. Kummel
Published 2026Fuente: Wiley Open AccessTipo de material: Artículo Open AccessAcceso al recurso