Three-dimensional imaging of integrated-circuit activity using quantum defects in diamond

Fuente: arXiv
Guardado en:
Detalles Bibliográficos
Autores principales: Garsi, Marwa, Stöhr, Rainer, Denisenko, Andrej, Shagieva, Farida, Trautmann, Nils, Vogl, Ulrich, Sene, Badou, Kaiser, Florian, Zappe, Andrea, Reuter, Rolf, Wrachtrup, Jörg
Formato: Preprint
Publicado: 2021
Materias:
Acceso en línea:
Etiquetas: Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!
_version_ 1866913386950819840
author Garsi, Marwa
Stöhr, Rainer
Denisenko, Andrej
Shagieva, Farida
Trautmann, Nils
Vogl, Ulrich
Sene, Badou
Kaiser, Florian
Zappe, Andrea
Reuter, Rolf
Wrachtrup, Jörg
author_facet Garsi, Marwa
Stöhr, Rainer
Denisenko, Andrej
Shagieva, Farida
Trautmann, Nils
Vogl, Ulrich
Sene, Badou
Kaiser, Florian
Zappe, Andrea
Reuter, Rolf
Wrachtrup, Jörg
contents The continuous scaling of semiconductor-based technologies to micron and sub-micron regimes has resulted in higher device density and lower power dissipation. Many physical phenomena such as self-heating or current leakage become significant at such scales, and mapping current densities to reveal these features is decisive for the development of modern electronics. However, advanced non-invasive technologies either offer low sensitivity or poor spatial resolution and are limited to two-dimensional spatial mapping. Here we use near-surface nitrogen-vacancy centres in diamond to probe Oersted fields created by current flowing within a multi-layered integrated circuit in pre-development. We show the reconstruction of the three-dimensional components of the current density with a magnitude down to about $\approx 10 \,\rm μA / μm^2$ and sub-micron spatial resolution at room temperature. We also report the localisation of currents in different layers and observe anomalous current flow in an electronic chip. Our method provides, therefore a decisive step toward three-dimensional current mapping in technologically relevant nanoscale electronics chips.
format Preprint
id arxiv_https___arxiv_org_abs_2112_12242
institution arXiv
publishDate 2021
record_format arxiv
spellingShingle Three-dimensional imaging of integrated-circuit activity using quantum defects in diamond
Garsi, Marwa
Stöhr, Rainer
Denisenko, Andrej
Shagieva, Farida
Trautmann, Nils
Vogl, Ulrich
Sene, Badou
Kaiser, Florian
Zappe, Andrea
Reuter, Rolf
Wrachtrup, Jörg
Applied Physics
Mesoscale and Nanoscale Physics
Quantum Physics
The continuous scaling of semiconductor-based technologies to micron and sub-micron regimes has resulted in higher device density and lower power dissipation. Many physical phenomena such as self-heating or current leakage become significant at such scales, and mapping current densities to reveal these features is decisive for the development of modern electronics. However, advanced non-invasive technologies either offer low sensitivity or poor spatial resolution and are limited to two-dimensional spatial mapping. Here we use near-surface nitrogen-vacancy centres in diamond to probe Oersted fields created by current flowing within a multi-layered integrated circuit in pre-development. We show the reconstruction of the three-dimensional components of the current density with a magnitude down to about $\approx 10 \,\rm μA / μm^2$ and sub-micron spatial resolution at room temperature. We also report the localisation of currents in different layers and observe anomalous current flow in an electronic chip. Our method provides, therefore a decisive step toward three-dimensional current mapping in technologically relevant nanoscale electronics chips.
title Three-dimensional imaging of integrated-circuit activity using quantum defects in diamond
topic Applied Physics
Mesoscale and Nanoscale Physics
Quantum Physics
url https://arxiv.org/abs/2112.12242