Cita APA (7a ed.)

Kim, I., Pansu, P., & Wan, X. (2022). Signature for flat unitary bundles over surfaces with boundary.

Cita Chicago Style (17a ed.)

Kim, Inkang, Pierre Pansu, y Xueyuan Wan. Signature for Flat Unitary Bundles over Surfaces with Boundary. 2022.

Cita MLA (9a ed.)

Kim, Inkang, et al. Signature for Flat Unitary Bundles over Surfaces with Boundary. 2022.