A 1.1- / 0.9-nA Temperature-Independent 213- / 565-ppm/$^\circ$C Self-Biased CMOS-Only Current Reference in 65-nm Bulk and 22-nm FDSOI

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Hauptverfasser: Lefebvre, Martin, Flandre, Denis, Bol, David
Format: Preprint
Veröffentlicht: 2023
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author Lefebvre, Martin
Flandre, Denis
Bol, David
author_facet Lefebvre, Martin
Flandre, Denis
Bol, David
contents In many applications, the ability of current references to cope with process, voltage, and temperature (PVT) variations is critical to maintaining system-level performance. However, temperature-independent current references operating in the nA range are rarely area-efficient due to the use of large resistors which occupy a significant silicon area at this current level. In this article, we introduce a nA-range constant-with-temperature (CWT) current reference relying on a self-cascode MOSFET (SCM), biased by a proportional-to-absolute-temperature (PTAT) voltage with a CWT offset. On the one hand, the proposed reference has been simulated post-layout in 65-nm bulk. This design consumes 5.4 nW at 0.7 V and achieves a 1.1-nA current with a line sensitivity (LS) of 0.69 %/V and a temperature coefficient (TC) of 213 ppm/$^\circ$C. On the other hand, the proposed reference has been simulated and fabricated in 22-nm fully depleted silicon-on-insulator (FDSOI). This second design requires additional features to mitigate the impact of parasitic diode leakage at high temperature. In measurement, it consumes 5.8 nW at 0.9 V and achieves a 0.9-nA current with a 0.39-%/V LS and a 565-ppm/$^\circ$C TC. As a result of using an SCM, the proposed references occupy a silicon area of 0.0021 mm$^2$ in 65 nm (respectively, 0.0132 mm$^2$ in 22 nm) at least 25$\times$ (respectively, 4$\times$) smaller than state-of-the-art CWT references operating in the same current range.
format Preprint
id arxiv_https___arxiv_org_abs_2302_04504
institution arXiv
publishDate 2023
record_format arxiv
spellingShingle A 1.1- / 0.9-nA Temperature-Independent 213- / 565-ppm/$^\circ$C Self-Biased CMOS-Only Current Reference in 65-nm Bulk and 22-nm FDSOI
Lefebvre, Martin
Flandre, Denis
Bol, David
Hardware Architecture
B.7.0
In many applications, the ability of current references to cope with process, voltage, and temperature (PVT) variations is critical to maintaining system-level performance. However, temperature-independent current references operating in the nA range are rarely area-efficient due to the use of large resistors which occupy a significant silicon area at this current level. In this article, we introduce a nA-range constant-with-temperature (CWT) current reference relying on a self-cascode MOSFET (SCM), biased by a proportional-to-absolute-temperature (PTAT) voltage with a CWT offset. On the one hand, the proposed reference has been simulated post-layout in 65-nm bulk. This design consumes 5.4 nW at 0.7 V and achieves a 1.1-nA current with a line sensitivity (LS) of 0.69 %/V and a temperature coefficient (TC) of 213 ppm/$^\circ$C. On the other hand, the proposed reference has been simulated and fabricated in 22-nm fully depleted silicon-on-insulator (FDSOI). This second design requires additional features to mitigate the impact of parasitic diode leakage at high temperature. In measurement, it consumes 5.8 nW at 0.9 V and achieves a 0.9-nA current with a 0.39-%/V LS and a 565-ppm/$^\circ$C TC. As a result of using an SCM, the proposed references occupy a silicon area of 0.0021 mm$^2$ in 65 nm (respectively, 0.0132 mm$^2$ in 22 nm) at least 25$\times$ (respectively, 4$\times$) smaller than state-of-the-art CWT references operating in the same current range.
title A 1.1- / 0.9-nA Temperature-Independent 213- / 565-ppm/$^\circ$C Self-Biased CMOS-Only Current Reference in 65-nm Bulk and 22-nm FDSOI
topic Hardware Architecture
B.7.0
url https://arxiv.org/abs/2302.04504