Electrochemical etching strategy for shaping monolithic 3D structures from 4H-SiC wafers

Fuente: arXiv
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Autores principales: Hochreiter, André, Groß, Fabian, Möller, Morris-Niklas, Krieger, Michael, Weber, Heiko B.
Formato: Preprint
Publicado: 2023
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author Hochreiter, André
Groß, Fabian
Möller, Morris-Niklas
Krieger, Michael
Weber, Heiko B.
author_facet Hochreiter, André
Groß, Fabian
Möller, Morris-Niklas
Krieger, Michael
Weber, Heiko B.
contents Silicon Carbide (SiC) is an outstanding material, not only for electronic applications, but also for projected functionalities in the realm of photonic quantum technologies, nano-mechanical resonators and photonics on-a-chip. For shaping 3D structures out of SiC wafers, predominantly dry-etching techniques are used. SiC is nearly inert with respect to wet-etching, occasionally photoelectrochemical etching strategies have been applied. Here, we propose an electrochemical etching strategy that solely relies on defining etchable volumina by implantation of p-dopands. Together with the inertness of the n-doped regions, very sharp etching contrasts can be achieved. We present devices as different as monolithic cantilevers, disk-shaped optical resonators and membranes etched out of a single crystal wafer. The high quality of the resulting surfaces can even be enhanced by thermal treatment, with shape-stable devices up to and even beyond 1550°C. The versatility of our approach paves the way for new functionalities on SiC as high-performance multi-functional wafer platform.
format Preprint
id arxiv_https___arxiv_org_abs_2306_12311
institution arXiv
publishDate 2023
record_format arxiv
spellingShingle Electrochemical etching strategy for shaping monolithic 3D structures from 4H-SiC wafers
Hochreiter, André
Groß, Fabian
Möller, Morris-Niklas
Krieger, Michael
Weber, Heiko B.
Mesoscale and Nanoscale Physics
Applied Physics
Silicon Carbide (SiC) is an outstanding material, not only for electronic applications, but also for projected functionalities in the realm of photonic quantum technologies, nano-mechanical resonators and photonics on-a-chip. For shaping 3D structures out of SiC wafers, predominantly dry-etching techniques are used. SiC is nearly inert with respect to wet-etching, occasionally photoelectrochemical etching strategies have been applied. Here, we propose an electrochemical etching strategy that solely relies on defining etchable volumina by implantation of p-dopands. Together with the inertness of the n-doped regions, very sharp etching contrasts can be achieved. We present devices as different as monolithic cantilevers, disk-shaped optical resonators and membranes etched out of a single crystal wafer. The high quality of the resulting surfaces can even be enhanced by thermal treatment, with shape-stable devices up to and even beyond 1550°C. The versatility of our approach paves the way for new functionalities on SiC as high-performance multi-functional wafer platform.
title Electrochemical etching strategy for shaping monolithic 3D structures from 4H-SiC wafers
topic Mesoscale and Nanoscale Physics
Applied Physics
url https://arxiv.org/abs/2306.12311