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| Main Authors: | , , , |
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| Format: | Preprint |
| Published: |
2023
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| Subjects: | |
| Online Access: | https://arxiv.org/abs/2307.08060 |
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| _version_ | 1866913388948357120 |
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| author | Zhao, Yujie Zhao, Yang Wan, Cheng Lin, Yingyan |
| author_facet | Zhao, Yujie Zhao, Yang Wan, Cheng Lin, Yingyan |
| contents | Environmental sustainability is crucial for Integrated Circuits (ICs) across their lifecycle, particularly in manufacturing and use. Meanwhile, ICs using 3D/2.5D integration technologies have emerged as promising solutions to meet the growing demands for computational power. However, there is a distinct lack of carbon modeling tools for 3D/2.5D ICs. Addressing this, we propose 3D-Carbon, an analytical carbon modeling tool designed to quantify the carbon emissions of 3D/2.5D ICs throughout their life cycle. 3D-Carbon factors in both potential savings and overheads from advanced integration technologies, considering practical deployment constraints like bandwidth. We validate 3D-Carbon's accuracy against established baselines and illustrate its utility through case studies in autonomous vehicles. We believe that 3D-Carbon lays the initial foundation for future innovations in developing environmentally sustainable 3D/2.5D ICs. Our open-source code is available at https://github.com/UMN-ZhaoLab/3D-Carbon. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2307_08060 |
| institution | arXiv |
| publishDate | 2023 |
| record_format | arxiv |
| spellingShingle | 3D-Carbon: An Analytical Carbon Modeling Tool for 3D and 2.5D Integrated Circuits Zhao, Yujie Zhao, Yang Wan, Cheng Lin, Yingyan Hardware Architecture Environmental sustainability is crucial for Integrated Circuits (ICs) across their lifecycle, particularly in manufacturing and use. Meanwhile, ICs using 3D/2.5D integration technologies have emerged as promising solutions to meet the growing demands for computational power. However, there is a distinct lack of carbon modeling tools for 3D/2.5D ICs. Addressing this, we propose 3D-Carbon, an analytical carbon modeling tool designed to quantify the carbon emissions of 3D/2.5D ICs throughout their life cycle. 3D-Carbon factors in both potential savings and overheads from advanced integration technologies, considering practical deployment constraints like bandwidth. We validate 3D-Carbon's accuracy against established baselines and illustrate its utility through case studies in autonomous vehicles. We believe that 3D-Carbon lays the initial foundation for future innovations in developing environmentally sustainable 3D/2.5D ICs. Our open-source code is available at https://github.com/UMN-ZhaoLab/3D-Carbon. |
| title | 3D-Carbon: An Analytical Carbon Modeling Tool for 3D and 2.5D Integrated Circuits |
| topic | Hardware Architecture |
| url | https://arxiv.org/abs/2307.08060 |