Copertina

3D-Carbon: An Analytical Carbon Modeling Tool for 3D and 2.5D Integrated Circuits

Fuente: arXiv

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Dettagli Bibliografici
Autori principali:	Zhao, Yujie, Zhao, Yang, Wan, Cheng, Lin, Yingyan
Natura:	Preprint
Pubblicazione:	2023
Soggetti:	Hardware Architecture
Accesso online:	Acceder al recurso
Tags:	Aggiungi Tag Nessun Tag, puoi essere il primo ad aggiungerne!!

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