In-Situ Thickness Measurement of Die Silicon Using Voltage Imaging for Hardware Assurance

Fuente: arXiv

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Bibliographic Details
Main Authors:	Dizon-Paradis, Olivia P., Varshney, Nitin, Rahman, M Tanjidur, Strizich, Michael, Shen, Haoting, Asadizanjani, Navid
Format:	Preprint
Published:	2023
Subjects:	Image and Video Processing
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2307.13118