In-Situ Thickness Measurement of Die Silicon Using Voltage Imaging for Hardware Assurance
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arXiv
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| Autores principales: | , , , , , |
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| Formato: | Preprint |
| Publicado: |
2023
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| _version_ | 1866913484407570432 |
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| author | Dizon-Paradis, Olivia P. Varshney, Nitin Rahman, M Tanjidur Strizich, Michael Shen, Haoting Asadizanjani, Navid |
| author_facet | Dizon-Paradis, Olivia P. Varshney, Nitin Rahman, M Tanjidur Strizich, Michael Shen, Haoting Asadizanjani, Navid |
| contents | Hardware assurance of electronics is a challenging task and is of great interest to the government and the electronics industry. Physical inspection-based methods such as reverse engineering (RE) and Trojan scanning (TS) play an important role in hardware assurance. Therefore, there is a growing demand for automation in RE and TS. Many state-of-the-art physical inspection methods incorporate an iterative imaging and delayering workflow. In practice, uniform delayering can be challenging if the thickness of the initial layer of material is non-uniform. Moreover, this non-uniformity can reoccur at any stage during delayering and must be corrected. Therefore, it is critical to evaluate the thickness of the layers to be removed in a real-time fashion. Our proposed method uses electron beam voltage imaging, image processing, and Monte Carlo simulation to measure the thickness of remaining silicon to guide a uniform delayering process |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2307_13118 |
| institution | arXiv |
| publishDate | 2023 |
| record_format | arxiv |
| spellingShingle | In-Situ Thickness Measurement of Die Silicon Using Voltage Imaging for Hardware Assurance Dizon-Paradis, Olivia P. Varshney, Nitin Rahman, M Tanjidur Strizich, Michael Shen, Haoting Asadizanjani, Navid Image and Video Processing Hardware assurance of electronics is a challenging task and is of great interest to the government and the electronics industry. Physical inspection-based methods such as reverse engineering (RE) and Trojan scanning (TS) play an important role in hardware assurance. Therefore, there is a growing demand for automation in RE and TS. Many state-of-the-art physical inspection methods incorporate an iterative imaging and delayering workflow. In practice, uniform delayering can be challenging if the thickness of the initial layer of material is non-uniform. Moreover, this non-uniformity can reoccur at any stage during delayering and must be corrected. Therefore, it is critical to evaluate the thickness of the layers to be removed in a real-time fashion. Our proposed method uses electron beam voltage imaging, image processing, and Monte Carlo simulation to measure the thickness of remaining silicon to guide a uniform delayering process |
| title | In-Situ Thickness Measurement of Die Silicon Using Voltage Imaging for Hardware Assurance |
| topic | Image and Video Processing |
| url | https://arxiv.org/abs/2307.13118 |