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Main Authors: Pan, Zuojian, Chen, Zhizhong, Chen, Yiyong, Zhang, Haodong, Yang, Han, Nie, Jingxin, Deng, Chuhan, Dong, Boyan, Wang, Daqi, Li, Yuchen, Chen, Weihua, Jiao, Fei, Kang, Xiangning, Jia, Chuanyu, Liang, Zhiwen, Wang, Qi, Zhang, Guoyi, Shen, Bo
Format: Preprint
Published: 2023
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Online Access:https://arxiv.org/abs/2308.10919
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author Pan, Zuojian
Chen, Zhizhong
Chen, Yiyong
Zhang, Haodong
Yang, Han
Nie, Jingxin
Deng, Chuhan
Dong, Boyan
Wang, Daqi
Li, Yuchen
Chen, Weihua
Jiao, Fei
Kang, Xiangning
Jia, Chuanyu
Liang, Zhiwen
Wang, Qi
Zhang, Guoyi
Shen, Bo
author_facet Pan, Zuojian
Chen, Zhizhong
Chen, Yiyong
Zhang, Haodong
Yang, Han
Nie, Jingxin
Deng, Chuhan
Dong, Boyan
Wang, Daqi
Li, Yuchen
Chen, Weihua
Jiao, Fei
Kang, Xiangning
Jia, Chuanyu
Liang, Zhiwen
Wang, Qi
Zhang, Guoyi
Shen, Bo
contents Two types of nucleation layers (NLs), including in-situ low-temperature grown GaN (LT-GaN) and ex-situ sputtered physical vapor deposition AlN (PVD-AlN), are applied on cone-shaped nanoscale patterned sapphire substrate (NPSS). The initial growth process of GaN on these two NLs is comparably investigated by a series of growth interruptions. The coalescence process of GaN grains is modulated by adjusting the three-dimensional (3D) temperatures. The results indicate that higher 3D temperatures reduce the edge dislocation density while increasing the residual compressive stress in GaN films. Compared to the LT-GaN NLs, the PVD-AlN NLs effectively resist Ostwald ripening and facilitate the uniform growth of GaN grains on NPSS. Furthermore, GaN films grown on NPSS with PVD-AlN NLs exhibit a reduction of over 50% in both screw and edge dislocation densities compared to those grown on LT-GaN NLs. Additionally, PVD-AlN NLs result in an increase of about 0.5 GPa in the residual compressive stress observed in GaN films.
format Preprint
id arxiv_https___arxiv_org_abs_2308_10919
institution arXiv
publishDate 2023
record_format arxiv
spellingShingle Effect of Grain Coalescence on Dislocation and Stress Evolution of GaN Films Grown on Nanoscale Patterned Sapphire Substrates
Pan, Zuojian
Chen, Zhizhong
Chen, Yiyong
Zhang, Haodong
Yang, Han
Nie, Jingxin
Deng, Chuhan
Dong, Boyan
Wang, Daqi
Li, Yuchen
Chen, Weihua
Jiao, Fei
Kang, Xiangning
Jia, Chuanyu
Liang, Zhiwen
Wang, Qi
Zhang, Guoyi
Shen, Bo
Materials Science
Two types of nucleation layers (NLs), including in-situ low-temperature grown GaN (LT-GaN) and ex-situ sputtered physical vapor deposition AlN (PVD-AlN), are applied on cone-shaped nanoscale patterned sapphire substrate (NPSS). The initial growth process of GaN on these two NLs is comparably investigated by a series of growth interruptions. The coalescence process of GaN grains is modulated by adjusting the three-dimensional (3D) temperatures. The results indicate that higher 3D temperatures reduce the edge dislocation density while increasing the residual compressive stress in GaN films. Compared to the LT-GaN NLs, the PVD-AlN NLs effectively resist Ostwald ripening and facilitate the uniform growth of GaN grains on NPSS. Furthermore, GaN films grown on NPSS with PVD-AlN NLs exhibit a reduction of over 50% in both screw and edge dislocation densities compared to those grown on LT-GaN NLs. Additionally, PVD-AlN NLs result in an increase of about 0.5 GPa in the residual compressive stress observed in GaN films.
title Effect of Grain Coalescence on Dislocation and Stress Evolution of GaN Films Grown on Nanoscale Patterned Sapphire Substrates
topic Materials Science
url https://arxiv.org/abs/2308.10919