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| Hauptverfasser: | , , , , , , , , |
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| Format: | Preprint |
| Veröffentlicht: |
2023
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| Online-Zugang: | https://arxiv.org/abs/2308.12496 |
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| _version_ | 1866917699891757056 |
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| author | Zhang, Zhihan Biswal, Agni K. Nandi, Ankush Frost, Kali Smith, Jake A. Nguyen, Bichlien H. Patel, Shwetak Vashisth, Aniruddh Iyer, Vikram |
| author_facet | Zhang, Zhihan Biswal, Agni K. Nandi, Ankush Frost, Kali Smith, Jake A. Nguyen, Bichlien H. Patel, Shwetak Vashisth, Aniruddh Iyer, Vikram |
| contents | Electronics are integral to modern life; however, at their end-of-life these devices produce environmentally hazardous electronic waste (e-waste). Recycling the ubiquitous printed circuit boards (PCBs) that make up a substantial mass and volume fraction of e-waste is challenging due to their use of irreversibly cured thermoset epoxies. We present a PCB formulation using transesterification vitrimers (vPCBs), and an end-to-end fabrication process compatible with standard manufacturing ecosystems. We create functional prototypes of IoT devices transmitting 2.4 GHz radio signals on vPCBs with electrical and mechanical properties meeting industry standards. Fractures and holes in vPCBs can be repaired while retaining comparable performance over more than four repair cycles. We further demonstrate non-destructive decomposition of transesterification vitrimer composites with solid inclusions and metal attachments by polymer swelling with small molecule solvents. We hypothesize that unlike traditional solvolysis recycling, swelling does not degrade the materials. Through dynamic mechanical analysis we find negligible catalyst loss, minimal changes in storage modulus, and equivalent polymer backbone composition across multiple recycling cycles. We achieve 98% polymer recovery, 100% fiber recovery, and 91% solvent recovery which we reuse to create new vPCBs without degraded performance. Our cradle-to-cradle life-cycle assessment shows substantial environmental impact reduction over conventional PCBs in 11 categories. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2308_12496 |
| institution | arXiv |
| publishDate | 2023 |
| record_format | arxiv |
| spellingShingle | Recyclable vitrimer-based printed circuit board for circular electronics Zhang, Zhihan Biswal, Agni K. Nandi, Ankush Frost, Kali Smith, Jake A. Nguyen, Bichlien H. Patel, Shwetak Vashisth, Aniruddh Iyer, Vikram Applied Physics Electronics are integral to modern life; however, at their end-of-life these devices produce environmentally hazardous electronic waste (e-waste). Recycling the ubiquitous printed circuit boards (PCBs) that make up a substantial mass and volume fraction of e-waste is challenging due to their use of irreversibly cured thermoset epoxies. We present a PCB formulation using transesterification vitrimers (vPCBs), and an end-to-end fabrication process compatible with standard manufacturing ecosystems. We create functional prototypes of IoT devices transmitting 2.4 GHz radio signals on vPCBs with electrical and mechanical properties meeting industry standards. Fractures and holes in vPCBs can be repaired while retaining comparable performance over more than four repair cycles. We further demonstrate non-destructive decomposition of transesterification vitrimer composites with solid inclusions and metal attachments by polymer swelling with small molecule solvents. We hypothesize that unlike traditional solvolysis recycling, swelling does not degrade the materials. Through dynamic mechanical analysis we find negligible catalyst loss, minimal changes in storage modulus, and equivalent polymer backbone composition across multiple recycling cycles. We achieve 98% polymer recovery, 100% fiber recovery, and 91% solvent recovery which we reuse to create new vPCBs without degraded performance. Our cradle-to-cradle life-cycle assessment shows substantial environmental impact reduction over conventional PCBs in 11 categories. |
| title | Recyclable vitrimer-based printed circuit board for circular electronics |
| topic | Applied Physics |
| url | https://arxiv.org/abs/2308.12496 |