Estimation of the FR4 Microwave Dielectric Properties at Cryogenic Temperature for Quantum-Chip-Interface PCBs Design
Fuente:
arXiv
Saved in:
| Main Authors: | , , , , , , |
|---|---|
| Format: | Preprint |
| Published: |
2023
|
| Subjects: | |
| Online Access: | |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| _version_ | 1866910783095439360 |
|---|---|
| author | Paghi, Alessandro Trupiano, Giacomo Puglia, Claudio Burgaud, Hannah De Simoni, Giorgio Greco, Angelo Giazotto, Francesco |
| author_facet | Paghi, Alessandro Trupiano, Giacomo Puglia, Claudio Burgaud, Hannah De Simoni, Giorgio Greco, Angelo Giazotto, Francesco |
| contents | Ad-hoc interface PCBs (Printed Circuit Boards) are today the standard connection between cryogenic cabling and quantum chips. Besides low-loss and low-temperature-dependent-dielectric-permittivity materials, Flame Resistance n.4 (FR4) provides a low-cost solution for fabrication of cryogenic PCBs. Here, we report on an effective way to evaluate the dielectric performance of a FR4 laminate used as substrate for cryogenic microwave PCBs. We designed a coplanar waveguide λ/2 open-circuit series resonator, and we fabricated the PCB using a low-cost manufacturing process, obtaining in-plane geometric features with maximum variations of 50-100 um compared to the PCB design. Such a geometry allows to exploit the resonance peak of the resonator to measure the variation of the complex permittivity as a function of the temperature. The resonance peak frequency was used to estimate the real permittivity, achieving a sensitivity of -470 MHz and a resolution of 1.2x10^-2. Similarly, the resonance peak magnitude was involved in the extrapolation of the loss tangent, reaching a sensitivity of ~-337 dB and a resolution of 1.6x^10-4. For the FR4 laminate used, we estimated a 9 % reduction of the real permittivity and a 70 % reduction of the loss tangent in the temperature range from 300 to 4 K. The proposed approach can be immediately extended to the detection of cryogenic temperature-dependent dielectric performance of any kind of substrate. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2310_01171 |
| institution | arXiv |
| publishDate | 2023 |
| record_format | arxiv |
| spellingShingle | Estimation of the FR4 Microwave Dielectric Properties at Cryogenic Temperature for Quantum-Chip-Interface PCBs Design Paghi, Alessandro Trupiano, Giacomo Puglia, Claudio Burgaud, Hannah De Simoni, Giorgio Greco, Angelo Giazotto, Francesco Instrumentation and Detectors Applied Physics Ad-hoc interface PCBs (Printed Circuit Boards) are today the standard connection between cryogenic cabling and quantum chips. Besides low-loss and low-temperature-dependent-dielectric-permittivity materials, Flame Resistance n.4 (FR4) provides a low-cost solution for fabrication of cryogenic PCBs. Here, we report on an effective way to evaluate the dielectric performance of a FR4 laminate used as substrate for cryogenic microwave PCBs. We designed a coplanar waveguide λ/2 open-circuit series resonator, and we fabricated the PCB using a low-cost manufacturing process, obtaining in-plane geometric features with maximum variations of 50-100 um compared to the PCB design. Such a geometry allows to exploit the resonance peak of the resonator to measure the variation of the complex permittivity as a function of the temperature. The resonance peak frequency was used to estimate the real permittivity, achieving a sensitivity of -470 MHz and a resolution of 1.2x10^-2. Similarly, the resonance peak magnitude was involved in the extrapolation of the loss tangent, reaching a sensitivity of ~-337 dB and a resolution of 1.6x^10-4. For the FR4 laminate used, we estimated a 9 % reduction of the real permittivity and a 70 % reduction of the loss tangent in the temperature range from 300 to 4 K. The proposed approach can be immediately extended to the detection of cryogenic temperature-dependent dielectric performance of any kind of substrate. |
| title | Estimation of the FR4 Microwave Dielectric Properties at Cryogenic Temperature for Quantum-Chip-Interface PCBs Design |
| topic | Instrumentation and Detectors Applied Physics |
| url | https://arxiv.org/abs/2310.01171 |