Mitigation of interfacial dielectric loss in aluminum-on-silicon superconducting qubits

Fuente: arXiv
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Main Authors: Biznárová, Janka, Osman, Amr, Rehnman, Emil, Chayanun, Lert, Križan, Christian, Malmberg, Per, Rommel, Marcus, Warren, Christopher, Delsing, Per, Yurgens, August, Bylander, Jonas, Roudsari, Anita Fadavi
Format: Preprint
Published: 2023
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author Biznárová, Janka
Osman, Amr
Rehnman, Emil
Chayanun, Lert
Križan, Christian
Malmberg, Per
Rommel, Marcus
Warren, Christopher
Delsing, Per
Yurgens, August
Bylander, Jonas
Roudsari, Anita Fadavi
author_facet Biznárová, Janka
Osman, Amr
Rehnman, Emil
Chayanun, Lert
Križan, Christian
Malmberg, Per
Rommel, Marcus
Warren, Christopher
Delsing, Per
Yurgens, August
Bylander, Jonas
Roudsari, Anita Fadavi
contents We demonstrate aluminum-on-silicon planar transmon qubits with time-averaged ${T_1}$ energy relaxation times of up to ${270\,μs}$, corresponding to Q = 5 million, and a highest observed value of ${501\,μs}$. We use materials analysis techniques and numerical simulations to investigate the dominant sources of energy loss, and devise and demonstrate a strategy towards mitigating them. The mitigation of loss is achieved by reducing the presence of oxide, a known host of defects, near the substrate-metal interface, by growing aluminum films thicker than 300 nm. A loss analysis of coplanar-waveguide resonators shows that the improvement is owing to a reduction of dielectric loss due to two-level system defects. We perform time-of-flight secondary ion mass spectrometry and observe a reduced presence of oxygen at the substrate-metal interface for the thicker films. The correlation between the enhanced performance and the film thickness is due to the tendency of aluminum to grow in columnar structures of parallel grain boundaries, where the size of the grain depends on the film thickness: transmission electron microscopy imaging shows that the thicker film has larger grains and consequently fewer grain boundaries containing oxide near this interface. These conclusions are supported by numerical simulations of the different loss contributions in the device.
format Preprint
id arxiv_https___arxiv_org_abs_2310_06797
institution arXiv
publishDate 2023
record_format arxiv
spellingShingle Mitigation of interfacial dielectric loss in aluminum-on-silicon superconducting qubits
Biznárová, Janka
Osman, Amr
Rehnman, Emil
Chayanun, Lert
Križan, Christian
Malmberg, Per
Rommel, Marcus
Warren, Christopher
Delsing, Per
Yurgens, August
Bylander, Jonas
Roudsari, Anita Fadavi
Quantum Physics
Superconductivity
We demonstrate aluminum-on-silicon planar transmon qubits with time-averaged ${T_1}$ energy relaxation times of up to ${270\,μs}$, corresponding to Q = 5 million, and a highest observed value of ${501\,μs}$. We use materials analysis techniques and numerical simulations to investigate the dominant sources of energy loss, and devise and demonstrate a strategy towards mitigating them. The mitigation of loss is achieved by reducing the presence of oxide, a known host of defects, near the substrate-metal interface, by growing aluminum films thicker than 300 nm. A loss analysis of coplanar-waveguide resonators shows that the improvement is owing to a reduction of dielectric loss due to two-level system defects. We perform time-of-flight secondary ion mass spectrometry and observe a reduced presence of oxygen at the substrate-metal interface for the thicker films. The correlation between the enhanced performance and the film thickness is due to the tendency of aluminum to grow in columnar structures of parallel grain boundaries, where the size of the grain depends on the film thickness: transmission electron microscopy imaging shows that the thicker film has larger grains and consequently fewer grain boundaries containing oxide near this interface. These conclusions are supported by numerical simulations of the different loss contributions in the device.
title Mitigation of interfacial dielectric loss in aluminum-on-silicon superconducting qubits
topic Quantum Physics
Superconductivity
url https://arxiv.org/abs/2310.06797