Heterogeneous integration of single InAs/InP quantum dots with the SOI chip using direct bonding

Fuente: arXiv

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Bibliographic Details
Main Authors:	Burakowski, Marek, Holewa, Paweł, Sakanas, Aurimas, Musiał, Anna, Sęk, Grzegorz, Mrowiński, Paweł, Yvind, Kresten, Semenova, Elizaveta, Syperek, Marcin
Format:	Preprint
Published:	2023
Subjects:	Optics Mesoscale and Nanoscale Physics
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2311.13961