Flat silicon gradient index lens with deep reactive-ion-etched 3-layer anti-reflection structure for millimeter and submillimeter wavelengths

Fuente: arXiv
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Main Authors: Defrance, Fabien, Jung-Kubiak, Cecile, Gill, John, Rahiminejad, Sofia, Macioce, Theodore, Sayers, Jack, Chattopadhyay, Goutam, Golwala, Sunil R.
Format: Preprint
Published: 2024
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author Defrance, Fabien
Jung-Kubiak, Cecile
Gill, John
Rahiminejad, Sofia
Macioce, Theodore
Sayers, Jack
Chattopadhyay, Goutam
Golwala, Sunil R.
author_facet Defrance, Fabien
Jung-Kubiak, Cecile
Gill, John
Rahiminejad, Sofia
Macioce, Theodore
Sayers, Jack
Chattopadhyay, Goutam
Golwala, Sunil R.
contents We present the design, fabrication, and characterization of a 100 mm diameter, flat, gradient-index (GRIN) lens fabricated with high-resistivity silicon, combined with a three-layer anti-reflection (AR) structure optimized for 160-355 GHz. Multi-depth, deep reactive-ion etching (DRIE) enables patterning of silicon wafers with sub-wavelength structures (posts or holes) to locally change the effective refractive index and thus create anti-reflection layers and a radial index gradient. The structures are non-resonant and, for sufficiently long wavelengths, achromatic. Hexagonal holes varying in size with distance from the optical axis create a parabolic index profile decreasing from 3.15 at the center of the lens to 1.87 at the edge. The AR structure consists of square holes and cross-shaped posts. We have fabricated a lens consisting of a stack of five 525 $μ$m thick GRIN wafers and one AR wafer on each face. We have characterized the lens over the frequency range 220-330 GHz, obtaining behavior consistent with Gaussian optics down to -14 dB and transmittance between 75% and 100%.
format Preprint
id arxiv_https___arxiv_org_abs_2401_17637
institution arXiv
publishDate 2024
record_format arxiv
spellingShingle Flat silicon gradient index lens with deep reactive-ion-etched 3-layer anti-reflection structure for millimeter and submillimeter wavelengths
Defrance, Fabien
Jung-Kubiak, Cecile
Gill, John
Rahiminejad, Sofia
Macioce, Theodore
Sayers, Jack
Chattopadhyay, Goutam
Golwala, Sunil R.
Optics
Instrumentation and Methods for Astrophysics
We present the design, fabrication, and characterization of a 100 mm diameter, flat, gradient-index (GRIN) lens fabricated with high-resistivity silicon, combined with a three-layer anti-reflection (AR) structure optimized for 160-355 GHz. Multi-depth, deep reactive-ion etching (DRIE) enables patterning of silicon wafers with sub-wavelength structures (posts or holes) to locally change the effective refractive index and thus create anti-reflection layers and a radial index gradient. The structures are non-resonant and, for sufficiently long wavelengths, achromatic. Hexagonal holes varying in size with distance from the optical axis create a parabolic index profile decreasing from 3.15 at the center of the lens to 1.87 at the edge. The AR structure consists of square holes and cross-shaped posts. We have fabricated a lens consisting of a stack of five 525 $μ$m thick GRIN wafers and one AR wafer on each face. We have characterized the lens over the frequency range 220-330 GHz, obtaining behavior consistent with Gaussian optics down to -14 dB and transmittance between 75% and 100%.
title Flat silicon gradient index lens with deep reactive-ion-etched 3-layer anti-reflection structure for millimeter and submillimeter wavelengths
topic Optics
Instrumentation and Methods for Astrophysics
url https://arxiv.org/abs/2401.17637