Amorphous Boron Nitride as an Ultrathin Copper Diffusion Barrier for Advanced Interconnects

Fuente: arXiv

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Bibliographic Details
Main Authors:	Kaya, Onurcan, Kim, Hyeongjoon, Kim, Byeongkyu, Galvani, Thomas, Colombo, Luigi, Lanza, Mario, Shin, Hyeon-Jin, Cole, Ivan, Shin, Hyeon Suk, Roche, Stephan
Format:	Preprint
Published:	2024
Subjects:	Materials Science
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2402.01251