Combining unsupervised and supervised learning in microscopy enables defect analysis of a full 4H-SiC wafer

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Bibliographic Details
Main Authors:	Nguyen, Binh Duong, Steiner, Johannes, Wellmann, Peter, Sandfeld, Stefan
Format:	Preprint
Published:	2024
Subjects:	Computer Vision and Pattern Recognition Materials Science Machine Learning
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2402.13353