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Combining unsupervised and supervised learning in microscopy enables defect analysis of a full 4H-SiC wafer

Fuente: arXiv

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Détails bibliographiques
Auteurs principaux:	Nguyen, Binh Duong, Steiner, Johannes, Wellmann, Peter, Sandfeld, Stefan
Format:	Preprint
Publié:	2024
Sujets:	Computer Vision and Pattern Recognition Materials Science Machine Learning
Accès en ligne:	Acceder al recurso
Tags:	Ajouter un tag Pas de tags, Soyez le premier à ajouter un tag!

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