Thermal-Aware Floorplanner for 3D IC, including TSVs, Liquid Microchannels and Thermal Domains Optimization

Fuente: arXiv

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Bibliographic Details
Main Authors:	Cuesta, David, Risco-Martín, José L., Ayala, José L., Hidalgo, J. Ignacio
Format:	Preprint
Published:	2024
Subjects:	Hardware Architecture
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2402.14627