3D-Printed Dielectric Image Lines towards Chip-to-Chip Interconnects for subTHz-Applications

Fuente: arXiv

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Bibliographic Details
Main Authors:	Hahn, Leonhard, Pfahler, Tim, Bader, Tobias, Gold, Gerald, Vossiek, Martin, Carlowitz, Christian
Format:	Preprint
Published:	2024
Subjects:	Systems and Control
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2403.03657