3D-Printed Dielectric Image Lines towards Chip-to-Chip Interconnects for subTHz-Applications
Fuente:
arXiv
Enregistré dans:
| Auteurs principaux: | , , , , , |
|---|---|
| Format: | Preprint |
| Publié: |
2024
|
| Sujets: | |
| Accès en ligne: | |
| Tags: |
Ajouter un tag
Pas de tags, Soyez le premier à ajouter un tag!
|
| _version_ | 1866909129547710464 |
|---|---|
| author | Hahn, Leonhard Pfahler, Tim Bader, Tobias Gold, Gerald Vossiek, Martin Carlowitz, Christian |
| author_facet | Hahn, Leonhard Pfahler, Tim Bader, Tobias Gold, Gerald Vossiek, Martin Carlowitz, Christian |
| contents | This paper reports on 3D-printed dielectric image lines for low-loss subTHz applications between 140 and 220 GHz. In contrast to conventional dielectric waveguides, a conductive copper substrate is used to achieve robust routing and increased mechanical stability. For easy integration and characterization of the dielectric image line within a waveguide measurement setup, a low-loss mode-converter for flexible mounting is further designed. The characterized overall system exhibits a broadband match of at least 20 dB over the entire frequency band, with minimal losses of below 0.35 dB/cm. Furthermore, multi-line characterization is performed for de-embedding the propagation parameters α and \b{eta} of both the dielectric transmission line and the mode-converter, and finally, the influence of discontinuities such as bending radii on the transmission behavior is evaluated. Due to the simplicity of the underlying 3D-printing technology, the proposed concept features extremely low cost and complexity, yet offers high flexibility and outperforms the losses of conventional transmission lines. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2403_03657 |
| institution | arXiv |
| publishDate | 2024 |
| record_format | arxiv |
| spellingShingle | 3D-Printed Dielectric Image Lines towards Chip-to-Chip Interconnects for subTHz-Applications Hahn, Leonhard Pfahler, Tim Bader, Tobias Gold, Gerald Vossiek, Martin Carlowitz, Christian Systems and Control This paper reports on 3D-printed dielectric image lines for low-loss subTHz applications between 140 and 220 GHz. In contrast to conventional dielectric waveguides, a conductive copper substrate is used to achieve robust routing and increased mechanical stability. For easy integration and characterization of the dielectric image line within a waveguide measurement setup, a low-loss mode-converter for flexible mounting is further designed. The characterized overall system exhibits a broadband match of at least 20 dB over the entire frequency band, with minimal losses of below 0.35 dB/cm. Furthermore, multi-line characterization is performed for de-embedding the propagation parameters α and \b{eta} of both the dielectric transmission line and the mode-converter, and finally, the influence of discontinuities such as bending radii on the transmission behavior is evaluated. Due to the simplicity of the underlying 3D-printing technology, the proposed concept features extremely low cost and complexity, yet offers high flexibility and outperforms the losses of conventional transmission lines. |
| title | 3D-Printed Dielectric Image Lines towards Chip-to-Chip Interconnects for subTHz-Applications |
| topic | Systems and Control |
| url | https://arxiv.org/abs/2403.03657 |