Analytical Heterogeneous Die-to-Die 3D Placement with Macros
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arXiv
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| Auteurs principaux: | , , , , , |
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| Format: | Preprint |
| Publié: |
2024
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| _version_ | 1866911985309843456 |
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| author | Zhao, Yuxuan Liao, Peiyu Liu, Siting Jiang, Jiaxi Lin, Yibo Yu, Bei |
| author_facet | Zhao, Yuxuan Liao, Peiyu Liu, Siting Jiang, Jiaxi Lin, Yibo Yu, Bei |
| contents | This paper presents an innovative approach to 3D mixed-size placement in heterogeneous face-to-face (F2F) bonded 3D ICs. We propose an analytical framework that utilizes a dedicated density model and a bistratal wirelength model, effectively handling macros and standard cells in a 3D solution space. A novel 3D preconditioner is developed to resolve the topological and physical gap between macros and standard cells. Additionally, we propose a mixed-integer linear programming (MILP) formulation for macro rotation to optimize wirelength. Our framework is implemented with full-scale GPU acceleration, leveraging an adaptive 3D density accumulation algorithm and an incremental wirelength gradient algorithm. Experimental results on ICCAD 2023 contest benchmarks demonstrate that our framework can achieve 5.9% quality score improvement compared to the first-place winner with 4.0x runtime speedup. Additional experiments on modern RISC-V designs further validate the generalizability and superiority of our framework. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2403_09070 |
| institution | arXiv |
| publishDate | 2024 |
| record_format | arxiv |
| spellingShingle | Analytical Heterogeneous Die-to-Die 3D Placement with Macros Zhao, Yuxuan Liao, Peiyu Liu, Siting Jiang, Jiaxi Lin, Yibo Yu, Bei Hardware Architecture This paper presents an innovative approach to 3D mixed-size placement in heterogeneous face-to-face (F2F) bonded 3D ICs. We propose an analytical framework that utilizes a dedicated density model and a bistratal wirelength model, effectively handling macros and standard cells in a 3D solution space. A novel 3D preconditioner is developed to resolve the topological and physical gap between macros and standard cells. Additionally, we propose a mixed-integer linear programming (MILP) formulation for macro rotation to optimize wirelength. Our framework is implemented with full-scale GPU acceleration, leveraging an adaptive 3D density accumulation algorithm and an incremental wirelength gradient algorithm. Experimental results on ICCAD 2023 contest benchmarks demonstrate that our framework can achieve 5.9% quality score improvement compared to the first-place winner with 4.0x runtime speedup. Additional experiments on modern RISC-V designs further validate the generalizability and superiority of our framework. |
| title | Analytical Heterogeneous Die-to-Die 3D Placement with Macros |
| topic | Hardware Architecture |
| url | https://arxiv.org/abs/2403.09070 |