Hot-LEGO: Architect Microfluidic Cooling Equipped 3DICs with Pre-RTL Thermal Simulation

Fuente: arXiv

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Bibliographic Details
Main Authors:	Wang, Runxi, Han, Jun-Han, Stan, Mircea, Guo, Xinfei
Format:	Preprint
Published:	2024
Subjects:	Hardware Architecture
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2403.20050