Timing resolution performance of Timepix4 bump-bonded assemblies
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arXiv
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| Format: | Preprint |
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2024
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| author | Bolzonella, Riccardo Alozy, Jerome Alexandre Ballabriga, Rafael van Beuzekom, Martin Biesuz, Nicolò Vladi Campbell, Michael Cardarelli, Paolo Cavallini, Viola Coco, Victor Ramusino, Angelo Cotta Fiorini, Massimiliano Gromov, Vladimir Guarise, Marco Cudie, Xavier Llopart Okamura, Shinichi Romolini, Gabriele Saputi, Alessandro Vitkovskiy, Arseniy |
| author_facet | Bolzonella, Riccardo Alozy, Jerome Alexandre Ballabriga, Rafael van Beuzekom, Martin Biesuz, Nicolò Vladi Campbell, Michael Cardarelli, Paolo Cavallini, Viola Coco, Victor Ramusino, Angelo Cotta Fiorini, Massimiliano Gromov, Vladimir Guarise, Marco Cudie, Xavier Llopart Okamura, Shinichi Romolini, Gabriele Saputi, Alessandro Vitkovskiy, Arseniy |
| contents | The timing performance of the Timepix4 application-specific integrated circuit (ASIC) bump-bonded to a $100\;μ\textrm{m}$ thick n-on-p silicon sensor is presented. A picosecond pulsed infrared laser was used to generate electron-hole pairs in the silicon bulk in a repeatable fashion, controlling the amount, position and time of the stimulated charge signal. The timing resolution for a single pixel has been measured to $107\;\textrm{ps}$ r.m.s. for laser-stimulated signals in the silicon sensor bulk. Considering multi-pixel clusters, the measured timing resolution reached $33\;\textrm{ps}$ r.m.s. exploiting oversampling of the timing information over several pixels. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2404_15499 |
| institution | arXiv |
| publishDate | 2024 |
| record_format | arxiv |
| spellingShingle | Timing resolution performance of Timepix4 bump-bonded assemblies Bolzonella, Riccardo Alozy, Jerome Alexandre Ballabriga, Rafael van Beuzekom, Martin Biesuz, Nicolò Vladi Campbell, Michael Cardarelli, Paolo Cavallini, Viola Coco, Victor Ramusino, Angelo Cotta Fiorini, Massimiliano Gromov, Vladimir Guarise, Marco Cudie, Xavier Llopart Okamura, Shinichi Romolini, Gabriele Saputi, Alessandro Vitkovskiy, Arseniy Instrumentation and Detectors The timing performance of the Timepix4 application-specific integrated circuit (ASIC) bump-bonded to a $100\;μ\textrm{m}$ thick n-on-p silicon sensor is presented. A picosecond pulsed infrared laser was used to generate electron-hole pairs in the silicon bulk in a repeatable fashion, controlling the amount, position and time of the stimulated charge signal. The timing resolution for a single pixel has been measured to $107\;\textrm{ps}$ r.m.s. for laser-stimulated signals in the silicon sensor bulk. Considering multi-pixel clusters, the measured timing resolution reached $33\;\textrm{ps}$ r.m.s. exploiting oversampling of the timing information over several pixels. |
| title | Timing resolution performance of Timepix4 bump-bonded assemblies |
| topic | Instrumentation and Detectors |
| url | https://arxiv.org/abs/2404.15499 |