mm-Wave and sub-THz Chip-to-Package Transitions for Communications Systems
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arXiv
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| Auteurs principaux: | , , |
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| Format: | Preprint |
| Publié: |
2024
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| _version_ | 1866914777407684608 |
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| author | Baniasadi, Nima Hijab, Rami Niknejad, Ali |
| author_facet | Baniasadi, Nima Hijab, Rami Niknejad, Ali |
| contents | This work presents mm-Wave and sub-THz chip-to-package transitions for communications systems. To date, reported transitions either have high loss, typically 3 to 4 dB, or require high cost packages to support very fine bump pitches and low loss materials. We analyze the impact of transitions on a high frequency, wide bandwidth communication system and present the design of a chip-to-package transition in two different commercial packaging technologies. The proposed transitions achieve <1 dB loss in both technologies, validating the design methodology. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2404_19263 |
| institution | arXiv |
| publishDate | 2024 |
| record_format | arxiv |
| spellingShingle | mm-Wave and sub-THz Chip-to-Package Transitions for Communications Systems Baniasadi, Nima Hijab, Rami Niknejad, Ali Systems and Control This work presents mm-Wave and sub-THz chip-to-package transitions for communications systems. To date, reported transitions either have high loss, typically 3 to 4 dB, or require high cost packages to support very fine bump pitches and low loss materials. We analyze the impact of transitions on a high frequency, wide bandwidth communication system and present the design of a chip-to-package transition in two different commercial packaging technologies. The proposed transitions achieve <1 dB loss in both technologies, validating the design methodology. |
| title | mm-Wave and sub-THz Chip-to-Package Transitions for Communications Systems |
| topic | Systems and Control |
| url | https://arxiv.org/abs/2404.19263 |