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| Autores principales: | , , |
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| Formato: | Preprint |
| Publicado: |
2024
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| Materias: | |
| Acceso en línea: | https://arxiv.org/abs/2404.19263 |
| Etiquetas: |
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- This work presents mm-Wave and sub-THz chip-to-package transitions for communications systems. To date, reported transitions either have high loss, typically 3 to 4 dB, or require high cost packages to support very fine bump pitches and low loss materials. We analyze the impact of transitions on a high frequency, wide bandwidth communication system and present the design of a chip-to-package transition in two different commercial packaging technologies. The proposed transitions achieve <1 dB loss in both technologies, validating the design methodology.