Cu$_x$Al$_{1-x}$ films as Alternatives to Copper for Advanced Interconnect Metallization

Fuente: arXiv

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Bibliographic Details
Main Authors:	Soulié, Jean-Philippe, Sankaran, Kiroubanand, Pourtois, Geoffrey, Swerts, Johan, Tőkei, Zsolt, Adelmann, Christoph
Format:	Preprint
Published:	2024
Subjects:	Materials Science
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2405.02046