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Enhancing and Mapping Thermal Boundary Conductance across Bonded Si/SiC Interface

Fuente: arXiv

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Bibliographic Details
Main Authors:	Guo, Rulei, Xu, Bin, Mu, Fengwen, Shiomi, Junichiro
Format:	Preprint
Published:	2024
Subjects:	Materials Science
Online Access:	Acceder al recurso
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