Improving the Accuracy of Temperature Measurement on TEM samples using Plasmon Energy Expansion Thermometry (PEET): Addressing Sample Thickness Effects

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Main Authors: Yang, Yi-Chieh, Serafin, Luca, Gauquelin, Nicolas, Verbeeck, Johan, Jinschek, Joerg R.
Format: Preprint
Published: 2024
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author Yang, Yi-Chieh
Serafin, Luca
Gauquelin, Nicolas
Verbeeck, Johan
Jinschek, Joerg R.
author_facet Yang, Yi-Chieh
Serafin, Luca
Gauquelin, Nicolas
Verbeeck, Johan
Jinschek, Joerg R.
contents Advances in analytical scanning transmission electron microscopy (STEM) and microelectronic mechanical systems (MEMS) based microheaters have enabled in-situ materials characterization at the nanometer scale at elevated temperature. In addition to resolving the structural information at elevated temperatures, detailed knowledge of the local temperature distribution inside the sample is essential to reveal thermally induced phenomena and processes. Here, we investigate the accuracy of plasmon energy expansion thermometry (PEET) as a method to map the local temperature in a tungsten (W) lamella in a range between room temperature and 700 degC. In particular, we address the influence of sample thickness in the range of a typical electron-transparent TEM sample (from 30 nm to 70 nm) on the temperature-dependent plasmon energy. The shift in plasmon energy, used to determine the local sample temperature, is not only temperature-dependent, but in case of W also thickness-dependent in sample thicknesses below approximately 60 nm. The results highlight the importance of considering sample thickness (and especially thickness variations) when analyzing the local bulk plasmon energy for temperature measurement using PEET. However, in case of W, an increasing beam broadening (FWHM) of the bulk plasmon peak with decreasing sample thickness can be used to improve the accuracy of PEET in TEM lamellae with varying sample thickness.
format Preprint
id arxiv_https___arxiv_org_abs_2407_20059
institution arXiv
publishDate 2024
record_format arxiv
spellingShingle Improving the Accuracy of Temperature Measurement on TEM samples using Plasmon Energy Expansion Thermometry (PEET): Addressing Sample Thickness Effects
Yang, Yi-Chieh
Serafin, Luca
Gauquelin, Nicolas
Verbeeck, Johan
Jinschek, Joerg R.
Materials Science
Instrumentation and Detectors
Advances in analytical scanning transmission electron microscopy (STEM) and microelectronic mechanical systems (MEMS) based microheaters have enabled in-situ materials characterization at the nanometer scale at elevated temperature. In addition to resolving the structural information at elevated temperatures, detailed knowledge of the local temperature distribution inside the sample is essential to reveal thermally induced phenomena and processes. Here, we investigate the accuracy of plasmon energy expansion thermometry (PEET) as a method to map the local temperature in a tungsten (W) lamella in a range between room temperature and 700 degC. In particular, we address the influence of sample thickness in the range of a typical electron-transparent TEM sample (from 30 nm to 70 nm) on the temperature-dependent plasmon energy. The shift in plasmon energy, used to determine the local sample temperature, is not only temperature-dependent, but in case of W also thickness-dependent in sample thicknesses below approximately 60 nm. The results highlight the importance of considering sample thickness (and especially thickness variations) when analyzing the local bulk plasmon energy for temperature measurement using PEET. However, in case of W, an increasing beam broadening (FWHM) of the bulk plasmon peak with decreasing sample thickness can be used to improve the accuracy of PEET in TEM lamellae with varying sample thickness.
title Improving the Accuracy of Temperature Measurement on TEM samples using Plasmon Energy Expansion Thermometry (PEET): Addressing Sample Thickness Effects
topic Materials Science
Instrumentation and Detectors
url https://arxiv.org/abs/2407.20059