Cita APA (7a ed.)

Nydegger, M., & Spolenak, R. (2024). Droplet-confined electroplating for nanoscale additive manufacturing: Current control of the initial stages of the growth of copper nanowires.

Cita Chicago Style (17a ed.)

Nydegger, Mirco, y Ralph Spolenak. Droplet-confined Electroplating for Nanoscale Additive Manufacturing: Current Control of the Initial Stages of the Growth of Copper Nanowires. 2024.

Cita MLA (9a ed.)

Nydegger, Mirco, y Ralph Spolenak. Droplet-confined Electroplating for Nanoscale Additive Manufacturing: Current Control of the Initial Stages of the Growth of Copper Nanowires. 2024.