Nydegger, M., & Spolenak, R. (2024). Droplet-confined electroplating for nanoscale additive manufacturing: Current control of the initial stages of the growth of copper nanowires.
Chicago Style (17th ed.) CitationNydegger, Mirco, and Ralph Spolenak. Droplet-confined Electroplating for Nanoscale Additive Manufacturing: Current Control of the Initial Stages of the Growth of Copper Nanowires. 2024.
MLA (9th ed.) CitationNydegger, Mirco, and Ralph Spolenak. Droplet-confined Electroplating for Nanoscale Additive Manufacturing: Current Control of the Initial Stages of the Growth of Copper Nanowires. 2024.
Warning: These citations may not always be 100% accurate.