SiTe CiM: Signed Ternary Computing-in-Memory for Ultra-Low Precision Deep Neural Networks
Fuente:
arXiv
Salvato in:
| Autori principali: | , , , , , |
|---|---|
| Natura: | Preprint |
| Pubblicazione: |
2024
|
| Soggetti: | |
| Accesso online: | |
| Tags: |
Aggiungi Tag
Nessun Tag, puoi essere il primo ad aggiungerne!!
|
| _version_ | 1866916368900685824 |
|---|---|
| author | Thakuria, Niharika Malhotra, Akul Thirumala, Sandeep K. Elangovan, Reena Raghunathan, Anand Gupta, Sumeet K. |
| author_facet | Thakuria, Niharika Malhotra, Akul Thirumala, Sandeep K. Elangovan, Reena Raghunathan, Anand Gupta, Sumeet K. |
| contents | Ternary Deep Neural Networks (DNN) have shown a large potential for highly energy-constrained systems by virtue of their low power operation (due to ultra-low precision) with only a mild degradation in accuracy. To enable an energy-efficient hardware substrate for such systems, we propose a compute-enabled memory design, referred to as SiTe-CiM, which features computing-in-memory (CiM) of dot products between signed ternary (SiTe) inputs and weights. SiTe CiM is based on cross-coupling of two bit cells to enable CiM of dot products in the signed ternary regime. We explore SiTe CiM with 8T-SRAM, 3T-embedded DRAM (3T-eDRAM) and 3T-ferroelectric metal FET (FEMFET) memories. We propose two flavors of this technique, namely SiTe CiM I/II. In SiTe CiM I, we employ two additional transistors per cell for cross-coupling, achieving fast CiM operations, albeit incurring an area overhead ranging from 18% to 34% (compared to standard ternary memories). In SiTe CiM II, four extra transistors are utilized for every 16 cells in a column, thereby incurring only 6% area cost (but leading to slower CiM than SiTe CiM I). Based on the array analysis, our designs achieve up to 88% lower CiM latency and 78% CiM energy savings across various technologies considered, as compared to their respective near-memory computing counterparts. Further, we perform system level analysis by incorporating SiTe CiM I/II arrays in a ternary DNN accelerator and show up to 7X throughput boost and up to 2.5X energy reduction compared to the near-memory ternary DNN accelerators. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2408_13617 |
| institution | arXiv |
| publishDate | 2024 |
| record_format | arxiv |
| spellingShingle | SiTe CiM: Signed Ternary Computing-in-Memory for Ultra-Low Precision Deep Neural Networks Thakuria, Niharika Malhotra, Akul Thirumala, Sandeep K. Elangovan, Reena Raghunathan, Anand Gupta, Sumeet K. Hardware Architecture Ternary Deep Neural Networks (DNN) have shown a large potential for highly energy-constrained systems by virtue of their low power operation (due to ultra-low precision) with only a mild degradation in accuracy. To enable an energy-efficient hardware substrate for such systems, we propose a compute-enabled memory design, referred to as SiTe-CiM, which features computing-in-memory (CiM) of dot products between signed ternary (SiTe) inputs and weights. SiTe CiM is based on cross-coupling of two bit cells to enable CiM of dot products in the signed ternary regime. We explore SiTe CiM with 8T-SRAM, 3T-embedded DRAM (3T-eDRAM) and 3T-ferroelectric metal FET (FEMFET) memories. We propose two flavors of this technique, namely SiTe CiM I/II. In SiTe CiM I, we employ two additional transistors per cell for cross-coupling, achieving fast CiM operations, albeit incurring an area overhead ranging from 18% to 34% (compared to standard ternary memories). In SiTe CiM II, four extra transistors are utilized for every 16 cells in a column, thereby incurring only 6% area cost (but leading to slower CiM than SiTe CiM I). Based on the array analysis, our designs achieve up to 88% lower CiM latency and 78% CiM energy savings across various technologies considered, as compared to their respective near-memory computing counterparts. Further, we perform system level analysis by incorporating SiTe CiM I/II arrays in a ternary DNN accelerator and show up to 7X throughput boost and up to 2.5X energy reduction compared to the near-memory ternary DNN accelerators. |
| title | SiTe CiM: Signed Ternary Computing-in-Memory for Ultra-Low Precision Deep Neural Networks |
| topic | Hardware Architecture |
| url | https://arxiv.org/abs/2408.13617 |