Experiment Research on Feasibility of In-Situ Plasma Cleaning in Normal-conducting Copper Cavities

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Hauptverfasser: Xia, Qianxu, Zheng, Lianmin, Du, Yingchao
Format: Preprint
Veröffentlicht: 2024
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author Xia, Qianxu
Zheng, Lianmin
Du, Yingchao
author_facet Xia, Qianxu
Zheng, Lianmin
Du, Yingchao
contents To assess the feasibility of in-situ plasma cleaning for copper cavities, a 13.56 MHz inductively coupled plasma platform with a built-in coil was developed at Tsinghua University. Experiments were conducted using this platform to optimize plasma discharge parameters and procedures specific to copper cavities. The results indicate that the "Ar/O + Ar/H method" significantly enhances the work function of the copper surface while reducing field enhancement effects induced by surface burrs. Consequently, this study confirms that in-situ plasma cleaning effectively mitigates field emission within copper cavities, thereby enhancing the stability and acceleration gradient of the accelerator system.
format Preprint
id arxiv_https___arxiv_org_abs_2408_14386
institution arXiv
publishDate 2024
record_format arxiv
spellingShingle Experiment Research on Feasibility of In-Situ Plasma Cleaning in Normal-conducting Copper Cavities
Xia, Qianxu
Zheng, Lianmin
Du, Yingchao
Plasma Physics
Accelerator Physics
To assess the feasibility of in-situ plasma cleaning for copper cavities, a 13.56 MHz inductively coupled plasma platform with a built-in coil was developed at Tsinghua University. Experiments were conducted using this platform to optimize plasma discharge parameters and procedures specific to copper cavities. The results indicate that the "Ar/O + Ar/H method" significantly enhances the work function of the copper surface while reducing field enhancement effects induced by surface burrs. Consequently, this study confirms that in-situ plasma cleaning effectively mitigates field emission within copper cavities, thereby enhancing the stability and acceleration gradient of the accelerator system.
title Experiment Research on Feasibility of In-Situ Plasma Cleaning in Normal-conducting Copper Cavities
topic Plasma Physics
Accelerator Physics
url https://arxiv.org/abs/2408.14386