Saved in:
| Main Authors: | , , |
|---|---|
| Format: | Preprint |
| Published: |
2024
|
| Subjects: | |
| Online Access: | https://arxiv.org/abs/2408.14386 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Table of Contents:
- To assess the feasibility of in-situ plasma cleaning for copper cavities, a 13.56 MHz inductively coupled plasma platform with a built-in coil was developed at Tsinghua University. Experiments were conducted using this platform to optimize plasma discharge parameters and procedures specific to copper cavities. The results indicate that the "Ar/O + Ar/H method" significantly enhances the work function of the copper surface while reducing field enhancement effects induced by surface burrs. Consequently, this study confirms that in-situ plasma cleaning effectively mitigates field emission within copper cavities, thereby enhancing the stability and acceleration gradient of the accelerator system.