Superconducting flip-chip devices using indium microspheres on Au-passivated Nb or NbN as under-bump metallization layer

Fuente: arXiv

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Bibliographic Details
Main Authors:	Paradkar, Achintya, Nicaise, Paul, Dakroury, Karim, Resare, Fabian, Wieczorek, Witlef
Format:	Preprint
Published:	2024
Subjects:	Superconductivity Materials Science Applied Physics
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2408.14655