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Superconducting flip-chip devices using indium microspheres on Au-passivated Nb or NbN as under-bump metallization layer

Fuente: arXiv

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Dettagli Bibliografici
Autori principali:	Paradkar, Achintya, Nicaise, Paul, Dakroury, Karim, Resare, Fabian, Wieczorek, Witlef
Natura:	Preprint
Pubblicazione:	2024
Soggetti:	Superconductivity Materials Science Applied Physics
Accesso online:	Acceder al recurso
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