3D System Design: A Case for Building Customized Modular Systems in 3D
Fuente:
arXiv
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| Autori principali: | , |
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| Natura: | Preprint |
| Pubblicazione: |
2024
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| Soggetti: | |
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| _version_ | 1866910603402018816 |
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| author | Emma, Philip Kurshan, Eren |
| author_facet | Emma, Philip Kurshan, Eren |
| contents | 3D promises a new dimension in composing systems by aggregating chips. Literally. While the most common uses are still tightly connected with its early forms as a packaging technology, new application domains have been emerging. As the underlying technology continues to evolve, the unique leverages of 3D have become increasingly appealing to a larger range of applications: from embedded mobile applications to servers and memory systems. In this paper we focus on the system-level implications of 3D technology, trying to differentiate the unique advantages that it provides to different market segments and applications. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2409_09068 |
| institution | arXiv |
| publishDate | 2024 |
| record_format | arxiv |
| spellingShingle | 3D System Design: A Case for Building Customized Modular Systems in 3D Emma, Philip Kurshan, Eren Distributed, Parallel, and Cluster Computing Emerging Technologies 3D promises a new dimension in composing systems by aggregating chips. Literally. While the most common uses are still tightly connected with its early forms as a packaging technology, new application domains have been emerging. As the underlying technology continues to evolve, the unique leverages of 3D have become increasingly appealing to a larger range of applications: from embedded mobile applications to servers and memory systems. In this paper we focus on the system-level implications of 3D technology, trying to differentiate the unique advantages that it provides to different market segments and applications. |
| title | 3D System Design: A Case for Building Customized Modular Systems in 3D |
| topic | Distributed, Parallel, and Cluster Computing Emerging Technologies |
| url | https://arxiv.org/abs/2409.09068 |