Saved in:
Bibliographic Details
Main Authors: Yu, Andrew, Srimani, Tathagata, Shulaker, Max
Format: Preprint
Published: 2024
Subjects:
Online Access:https://arxiv.org/abs/2409.11297
Tags: Add Tag
No Tags, Be the first to tag this record!
_version_ 1866929714990415872
author Yu, Andrew
Srimani, Tathagata
Shulaker, Max
author_facet Yu, Andrew
Srimani, Tathagata
Shulaker, Max
contents Back-end-of-line (BEOL) logic integration is emerging as a complementary scaling path to supplement front-end-of-line (FEOL) Silicon. Among various options for BEOL logic, Carbon Nanotube Field-Effect Transistors (CNFETs) have been integrated within commercial silicon foundries, and complex CNFET circuits (e.g., RISC-V core, SRAM arrays) have been demonstrated. However, there lacks comprehensive studies that analyze the ambient drift (i.e., air-stability) and reliability of CNFETs. Here, for the first time, we thoroughly characterize and demonstrate how to overcome ambient drift and negative bias temperature instability (NBTI) in CNFETs using the following techniques: (1) Silicon Nitride encapsulation to limit ambient atmosphere induced threshold voltage shift (~8x reduction of median VT shift over 90 days) and (2) AC/pulsed operation to significantly improve CNFET NBTI vs. DC operation across a wide frequency range (e.g., 20% duty cycle AC operation at 10 MHz could extend CNFET NBTI time-to-failure by >10000x vs. DC for a target VT shift tolerance < 100 mV with gate stress bias VGS,stress = -1.2 V at 125 C).
format Preprint
id arxiv_https___arxiv_org_abs_2409_11297
institution arXiv
publishDate 2024
record_format arxiv
spellingShingle Overcoming Ambient Drift and Negative-Bias Temperature Instability in Foundry Carbon Nanotube Transistors
Yu, Andrew
Srimani, Tathagata
Shulaker, Max
Emerging Technologies
Applied Physics
Back-end-of-line (BEOL) logic integration is emerging as a complementary scaling path to supplement front-end-of-line (FEOL) Silicon. Among various options for BEOL logic, Carbon Nanotube Field-Effect Transistors (CNFETs) have been integrated within commercial silicon foundries, and complex CNFET circuits (e.g., RISC-V core, SRAM arrays) have been demonstrated. However, there lacks comprehensive studies that analyze the ambient drift (i.e., air-stability) and reliability of CNFETs. Here, for the first time, we thoroughly characterize and demonstrate how to overcome ambient drift and negative bias temperature instability (NBTI) in CNFETs using the following techniques: (1) Silicon Nitride encapsulation to limit ambient atmosphere induced threshold voltage shift (~8x reduction of median VT shift over 90 days) and (2) AC/pulsed operation to significantly improve CNFET NBTI vs. DC operation across a wide frequency range (e.g., 20% duty cycle AC operation at 10 MHz could extend CNFET NBTI time-to-failure by >10000x vs. DC for a target VT shift tolerance < 100 mV with gate stress bias VGS,stress = -1.2 V at 125 C).
title Overcoming Ambient Drift and Negative-Bias Temperature Instability in Foundry Carbon Nanotube Transistors
topic Emerging Technologies
Applied Physics
url https://arxiv.org/abs/2409.11297