Micro-transfer printing of GaSb optoelectronics chips for mid-infrared silicon photonics integrated circuits

Fuente: arXiv
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Hauptverfasser: Tuorila, Heidi, Viheriälä, Jukka, Arafat, Yeasir, Atar, Fatih Bilge, Gunning, Fatima, Corbett, Brian, Guina, Mircea
Format: Preprint
Veröffentlicht: 2024
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author Tuorila, Heidi
Viheriälä, Jukka
Arafat, Yeasir
Atar, Fatih Bilge
Gunning, Fatima
Corbett, Brian
Guina, Mircea
author_facet Tuorila, Heidi
Viheriälä, Jukka
Arafat, Yeasir
Atar, Fatih Bilge
Gunning, Fatima
Corbett, Brian
Guina, Mircea
contents 3D integration of GaSb-based gain chips on a silicon photonics platform using micro-transfer printing is demonstrated for the first time. The release process of GaSb coupons, and their transfer for the demonstration of hybrid GaSb/Silicon-photonics on-chip external cavity lasers is reported. A methodology to evaluate the key features of the gain chip coupons, namely the quality of the etched facets and the facet coating deposited using a wafer-level process, is introduced. The characterization provides insight into the fabrication factors limiting the performance of the gain coupons. The level of performance achieved for the transfer printing process offers a solid landmark for the development of photonics integration technology operating at the 2-3 $μ$m wavelength range. This is instrumental for the deployment of mid-IR photonic integration technology in emerging applications related to gas and biomarker sensing.
format Preprint
id arxiv_https___arxiv_org_abs_2409_13413
institution arXiv
publishDate 2024
record_format arxiv
spellingShingle Micro-transfer printing of GaSb optoelectronics chips for mid-infrared silicon photonics integrated circuits
Tuorila, Heidi
Viheriälä, Jukka
Arafat, Yeasir
Atar, Fatih Bilge
Gunning, Fatima
Corbett, Brian
Guina, Mircea
Applied Physics
3D integration of GaSb-based gain chips on a silicon photonics platform using micro-transfer printing is demonstrated for the first time. The release process of GaSb coupons, and their transfer for the demonstration of hybrid GaSb/Silicon-photonics on-chip external cavity lasers is reported. A methodology to evaluate the key features of the gain chip coupons, namely the quality of the etched facets and the facet coating deposited using a wafer-level process, is introduced. The characterization provides insight into the fabrication factors limiting the performance of the gain coupons. The level of performance achieved for the transfer printing process offers a solid landmark for the development of photonics integration technology operating at the 2-3 $μ$m wavelength range. This is instrumental for the deployment of mid-IR photonic integration technology in emerging applications related to gas and biomarker sensing.
title Micro-transfer printing of GaSb optoelectronics chips for mid-infrared silicon photonics integrated circuits
topic Applied Physics
url https://arxiv.org/abs/2409.13413