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MFIT: Multi-Fidelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures

Fuente: arXiv

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Bibliographic Details
Main Authors:	Pfromm, Lukas, Kanani, Alish, Sharma, Harsh, Solanki, Parth, Tervo, Eric, Park, Jaehyun, Doppa, Janardhan Rao, Pande, Partha Pratim, Ogras, Umit Y.
Format:	Preprint
Published:	2024
Subjects:	Hardware Architecture
Online Access:	Acceder al recurso
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