Impact of the NO annealing duration on the SiO2/4H-SiC interface properties in lateral MOSFETs: the energetic profile of the near-interface-oxide traps

Fuente: arXiv
Salvato in:
Dettagli Bibliografici
Autori principali: Fiorenza, Patrick, Zignale, Marco, Camalleri, Marco, Scalia, Laura, Zanetti, Edoardo, Saggio, Mario, Giannazzo, Filippo, Roccaforte, Fabrizio
Natura: Preprint
Pubblicazione: 2024
Soggetti:
Accesso online:
Tags: Aggiungi Tag
Nessun Tag, puoi essere il primo ad aggiungerne!!
_version_ 1866913565910237184
author Fiorenza, Patrick
Zignale, Marco
Camalleri, Marco
Scalia, Laura
Zanetti, Edoardo
Saggio, Mario
Giannazzo, Filippo
Roccaforte, Fabrizio
author_facet Fiorenza, Patrick
Zignale, Marco
Camalleri, Marco
Scalia, Laura
Zanetti, Edoardo
Saggio, Mario
Giannazzo, Filippo
Roccaforte, Fabrizio
contents In this work, the effects of the duration of the post deposition annealing (PDA) in nitric oxide (NO) on the properties of SiO2/4H-SiC interfaces in n-channel lateral MOSFETs are investigated, with a special focus on the modifications of the energy profile of near-interface-oxide traps (NIOTs). For this purpose, the electrical characteristics of lateral MOSFETs were studied in strong inversion conditions, monitoring the threshold voltage variations due to charge trapping effects. To determine the energetic position of the NIOTs with respect of the SiO2 conduction band edge, the Fermi level position in the insulating layer was evaluated by TCAD simulations of the band diagrams. PDAs of the gate oxide of different duration resulted into similar shape of the energetic profile of the traps inside the insulator with respect of the SiO2 conduction band edge, but with different magnitude. Finally, the effective decrease of the insulator traps is demonstrated despite a saturation of the interface state density under prolonged PDAs and in particular the charge trapped at the NIOTs is reduced from 1-2 x 1011 cm-2 down to 3 x 1011 cm-2 varying the PDA duration from 10 up to 120 min in NO at 1175 degree C.
format Preprint
id arxiv_https___arxiv_org_abs_2410_21235
institution arXiv
publishDate 2024
record_format arxiv
spellingShingle Impact of the NO annealing duration on the SiO2/4H-SiC interface properties in lateral MOSFETs: the energetic profile of the near-interface-oxide traps
Fiorenza, Patrick
Zignale, Marco
Camalleri, Marco
Scalia, Laura
Zanetti, Edoardo
Saggio, Mario
Giannazzo, Filippo
Roccaforte, Fabrizio
Materials Science
Applied Physics
In this work, the effects of the duration of the post deposition annealing (PDA) in nitric oxide (NO) on the properties of SiO2/4H-SiC interfaces in n-channel lateral MOSFETs are investigated, with a special focus on the modifications of the energy profile of near-interface-oxide traps (NIOTs). For this purpose, the electrical characteristics of lateral MOSFETs were studied in strong inversion conditions, monitoring the threshold voltage variations due to charge trapping effects. To determine the energetic position of the NIOTs with respect of the SiO2 conduction band edge, the Fermi level position in the insulating layer was evaluated by TCAD simulations of the band diagrams. PDAs of the gate oxide of different duration resulted into similar shape of the energetic profile of the traps inside the insulator with respect of the SiO2 conduction band edge, but with different magnitude. Finally, the effective decrease of the insulator traps is demonstrated despite a saturation of the interface state density under prolonged PDAs and in particular the charge trapped at the NIOTs is reduced from 1-2 x 1011 cm-2 down to 3 x 1011 cm-2 varying the PDA duration from 10 up to 120 min in NO at 1175 degree C.
title Impact of the NO annealing duration on the SiO2/4H-SiC interface properties in lateral MOSFETs: the energetic profile of the near-interface-oxide traps
topic Materials Science
Applied Physics
url https://arxiv.org/abs/2410.21235