From Flip FET to Flip 3D Integration (F3D): Maximizing the Scaling Potential of Wafer Both Sides Beyond Conventional 3D Integration

Fuente: arXiv

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Bibliographic Details
Main Authors:	Wu, Heng, Lu, Haoran, Peng, Wanyue, Xu, Ziqiao, Chu, Yanbang, Sun, Jiacheng, Zhou, Falong, Wu, Jack, Zhang, Lijie, Bu, Weihai, Kang, Jin, Li, Ming, Lin, Yibo, Wang, Runsheng, Zhang, Xin, Huang, Ru
Format:	Preprint
Published:	2024
Subjects:	Mesoscale and Nanoscale Physics
Online Access:	Acceder al recurso
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Internet

https://arxiv.org/abs/2411.00309