Electron dynamics and SiO2 etching profile evolution in capacitive Ar/CHF3 discharges driven by sawtooth-tailored voltage waveforms
Fuente:
arXiv
Salvato in:
| Autori principali: | , , , , , |
|---|---|
| Natura: | Preprint |
| Pubblicazione: |
2024
|
| Soggetti: | |
| Accesso online: | |
| Tags: |
Aggiungi Tag
Nessun Tag, puoi essere il primo ad aggiungerne!!
|
| _version_ | 1866915015861207040 |
|---|---|
| author | Dong, Wan Song, Liu-Qin Zhang, Yi-Fan Wang, Li Song, Yuan-Hong Schulze, Julian |
| author_facet | Dong, Wan Song, Liu-Qin Zhang, Yi-Fan Wang, Li Song, Yuan-Hong Schulze, Julian |
| contents | The electron dynamics and SiO2 etching profile evolution in capacitively coupled Ar/CHF3 plasmas driven by sawtooth-waveforms are investigated based on a one-dimensional fluid/Monte-Carlo (MC) model coupled with an etching profile evolution model. The effects of the sawtooth-waveforms synthesized from different numbers of consecutive harmonics, N, of a fundamental frequency of 13.56 MHz on the electron dynamics, ion and neutral transport, as well as the etching profile evolution are revealed in different mixtures of Ar/CHF3. By increasing N, a reduction in electronegativity, a decrease of the DC self-bias voltage, and a transition of the discharge mode from the Drift-Ambipolar (DA) to an α-DA hybrid mode is observed accompanied by an enhanced plasma asymmetry. As the CHF3 gas admixture increases, the electronegativity initially increases and then decreases, following a similar trend as the absolute value of the DC self-bias voltage. This is mainly caused by the change in ionization, attachment and de-attachment reaction rates. The obtained results show that placing the substrate on the grounded electrode and using a higher number of harmonic frequencies (N) can achieve a faster etching rate, since higher ion fluxes can be obtained in these scenarios. Additionally, the Ar/CHF3 gas mixing ratio impacts the neutral surface coverage, which in turn affects the etching rate. Therefore, selecting an appropriate gas mixture is also essential for optimizing etching results. |
| format | Preprint |
| id |
arxiv_https___arxiv_org_abs_2411_07839 |
| institution | arXiv |
| publishDate | 2024 |
| record_format | arxiv |
| spellingShingle | Electron dynamics and SiO2 etching profile evolution in capacitive Ar/CHF3 discharges driven by sawtooth-tailored voltage waveforms Dong, Wan Song, Liu-Qin Zhang, Yi-Fan Wang, Li Song, Yuan-Hong Schulze, Julian Plasma Physics The electron dynamics and SiO2 etching profile evolution in capacitively coupled Ar/CHF3 plasmas driven by sawtooth-waveforms are investigated based on a one-dimensional fluid/Monte-Carlo (MC) model coupled with an etching profile evolution model. The effects of the sawtooth-waveforms synthesized from different numbers of consecutive harmonics, N, of a fundamental frequency of 13.56 MHz on the electron dynamics, ion and neutral transport, as well as the etching profile evolution are revealed in different mixtures of Ar/CHF3. By increasing N, a reduction in electronegativity, a decrease of the DC self-bias voltage, and a transition of the discharge mode from the Drift-Ambipolar (DA) to an α-DA hybrid mode is observed accompanied by an enhanced plasma asymmetry. As the CHF3 gas admixture increases, the electronegativity initially increases and then decreases, following a similar trend as the absolute value of the DC self-bias voltage. This is mainly caused by the change in ionization, attachment and de-attachment reaction rates. The obtained results show that placing the substrate on the grounded electrode and using a higher number of harmonic frequencies (N) can achieve a faster etching rate, since higher ion fluxes can be obtained in these scenarios. Additionally, the Ar/CHF3 gas mixing ratio impacts the neutral surface coverage, which in turn affects the etching rate. Therefore, selecting an appropriate gas mixture is also essential for optimizing etching results. |
| title | Electron dynamics and SiO2 etching profile evolution in capacitive Ar/CHF3 discharges driven by sawtooth-tailored voltage waveforms |
| topic | Plasma Physics |
| url | https://arxiv.org/abs/2411.07839 |