_version_ 1866912117862432768
author Ploerer, Eduardo
Baba, Hitoshi
Baudot, Jerome
Besson, Auguste
Bugiel, Szymon
Chujo, Tatsuya
Colledani, Claude
Dorokhov, Andrei
Bitar, Ziad El
Goffe, Mathieu
Gunji, Taku
Hu-Guo, Christine
Ilg, Armin
Jaaskelainen, Kimmo
Katsuno, Towa
Kluge, Alexander
Kostina, Anhelina
Kumar, Ajit
Lorenzetti, Alessandra
Macchiolo, Anna
Mager, Magnus
Park, Jonghan
Sakai, Shingo
Senyukov, Serhiy
Shamas, Hasan
Shibata, Daito
Snoeys, Walter
Stanek, Pavel
Suljic, Miljenko
Tomasek, Lukas
Valin, Isabelle
Wada, Reita
Yamaguchi, Yorito
Collaboration, the ALICE
author_facet Ploerer, Eduardo
Baba, Hitoshi
Baudot, Jerome
Besson, Auguste
Bugiel, Szymon
Chujo, Tatsuya
Colledani, Claude
Dorokhov, Andrei
Bitar, Ziad El
Goffe, Mathieu
Gunji, Taku
Hu-Guo, Christine
Ilg, Armin
Jaaskelainen, Kimmo
Katsuno, Towa
Kluge, Alexander
Kostina, Anhelina
Kumar, Ajit
Lorenzetti, Alessandra
Macchiolo, Anna
Mager, Magnus
Park, Jonghan
Sakai, Shingo
Senyukov, Serhiy
Shamas, Hasan
Shibata, Daito
Snoeys, Walter
Stanek, Pavel
Suljic, Miljenko
Tomasek, Lukas
Valin, Isabelle
Wada, Reita
Yamaguchi, Yorito
Collaboration, the ALICE
contents Within the context of the ALICE ITS3 collaboration, a set of MAPS small-scale test structures were developed using the 65 nm TPSCo CMOS imaging process with the upgrade of the ALICE inner tracking system as its primary focus. One such sensor, the Circuit Exploratoire 65 nm (CE-65), and its evolution the CE-65v2, were developed to explore charge collection properties for varying configurations including collection layer process (standard, blanket, modified with gap), pixel pitch (15, 18, \SI{22.5}{\micro\meter}), and pixel geometry (square vs hexagonal/staggered). In this work the characterisation of the CE-65v2 chip, based on $^{55}$Fe lab measurements and test beams at CERN SPS, is presented. Matrix gain uniformity up to the $\mathcal{O}$(5\%) level was demonstrated for all considered chip configurations. The CE-65v2 chip achieves a spatial resolution of under \SI{2}{\micro\meter} during beam tests. Process modifications allowing for faster charge collection and less charge sharing result in decreased spatial resolution, but a considerably wider range of operation, with both the \SI{15}{\micro\meter} and \SI{22.5}{\micro\meter} chips achieving over 99\% efficiency up to a $\sim$180 e$^{-}$ seed threshold. The results serve to validate the 65 nm TPSCo CMOS process, as well as to motivate design choices in future particle detection experiments.
format Preprint
id arxiv_https___arxiv_org_abs_2411_08740
institution arXiv
publishDate 2024
record_format arxiv
spellingShingle Characterisation of analogue MAPS produced in the 65 nm TPSCo process
Ploerer, Eduardo
Baba, Hitoshi
Baudot, Jerome
Besson, Auguste
Bugiel, Szymon
Chujo, Tatsuya
Colledani, Claude
Dorokhov, Andrei
Bitar, Ziad El
Goffe, Mathieu
Gunji, Taku
Hu-Guo, Christine
Ilg, Armin
Jaaskelainen, Kimmo
Katsuno, Towa
Kluge, Alexander
Kostina, Anhelina
Kumar, Ajit
Lorenzetti, Alessandra
Macchiolo, Anna
Mager, Magnus
Park, Jonghan
Sakai, Shingo
Senyukov, Serhiy
Shamas, Hasan
Shibata, Daito
Snoeys, Walter
Stanek, Pavel
Suljic, Miljenko
Tomasek, Lukas
Valin, Isabelle
Wada, Reita
Yamaguchi, Yorito
Collaboration, the ALICE
Instrumentation and Detectors
High Energy Physics - Experiment
Within the context of the ALICE ITS3 collaboration, a set of MAPS small-scale test structures were developed using the 65 nm TPSCo CMOS imaging process with the upgrade of the ALICE inner tracking system as its primary focus. One such sensor, the Circuit Exploratoire 65 nm (CE-65), and its evolution the CE-65v2, were developed to explore charge collection properties for varying configurations including collection layer process (standard, blanket, modified with gap), pixel pitch (15, 18, \SI{22.5}{\micro\meter}), and pixel geometry (square vs hexagonal/staggered). In this work the characterisation of the CE-65v2 chip, based on $^{55}$Fe lab measurements and test beams at CERN SPS, is presented. Matrix gain uniformity up to the $\mathcal{O}$(5\%) level was demonstrated for all considered chip configurations. The CE-65v2 chip achieves a spatial resolution of under \SI{2}{\micro\meter} during beam tests. Process modifications allowing for faster charge collection and less charge sharing result in decreased spatial resolution, but a considerably wider range of operation, with both the \SI{15}{\micro\meter} and \SI{22.5}{\micro\meter} chips achieving over 99\% efficiency up to a $\sim$180 e$^{-}$ seed threshold. The results serve to validate the 65 nm TPSCo CMOS process, as well as to motivate design choices in future particle detection experiments.
title Characterisation of analogue MAPS produced in the 65 nm TPSCo process
topic Instrumentation and Detectors
High Energy Physics - Experiment
url https://arxiv.org/abs/2411.08740