Heterostructure and Interfacial Engineering for Low-Resistance Contacts to Ultra-Wide Bandgap AlGaN

Fuente: arXiv
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Auteurs principaux: Zhu, Yinxuan, Allerman, Andrew A., Joishi, Chandan, Pratt, Jonathan, Xavier, Agnes Maneesha Dominic Merwin, Ortiz, Gabriel Calderon, Klein, Brianna A., Armstrong, Andrew, Hwang, Jinwoo, Rajan, Siddharth
Format: Preprint
Publié: 2024
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author Zhu, Yinxuan
Allerman, Andrew A.
Joishi, Chandan
Pratt, Jonathan
Xavier, Agnes Maneesha Dominic Merwin
Ortiz, Gabriel Calderon
Klein, Brianna A.
Armstrong, Andrew
Hwang, Jinwoo
Rajan, Siddharth
author_facet Zhu, Yinxuan
Allerman, Andrew A.
Joishi, Chandan
Pratt, Jonathan
Xavier, Agnes Maneesha Dominic Merwin
Ortiz, Gabriel Calderon
Klein, Brianna A.
Armstrong, Andrew
Hwang, Jinwoo
Rajan, Siddharth
contents We report on the heterostructure and interfacial engineering of metalorganic chemical vapor deposition (MOCVD) grown reverse-graded contacts to ultra-wide bandgap AlGaN. A record low contact resistivity of 1.4 x 10-6 Ohm.cm2 was reported on an Al0.82Ga0.18N metal semiconductor field effect transistor (MESFET) by compositionally grading the contact layer from Al0.85Ga0.15N to Al0.14Ga0.86N with degenerate doping and proper interfacial engineering considering bandgap-narrowing-induced band offset between channel and contact layer. This represents orders-of-magnitude of lower contact resistivity than that obtained in similar MOCVD-grown structures. A detailed, layer-by-layer analysis of the reverse graded contact and TCAD simulation of the bandgap narrowing effect highlighted that the reverse graded contact layer itself is extremely conductive and interfacial resistance due to bandgap-narrowing-induced barrier between contact and channel dominates the contact resistance.
format Preprint
id arxiv_https___arxiv_org_abs_2411_10566
institution arXiv
publishDate 2024
record_format arxiv
spellingShingle Heterostructure and Interfacial Engineering for Low-Resistance Contacts to Ultra-Wide Bandgap AlGaN
Zhu, Yinxuan
Allerman, Andrew A.
Joishi, Chandan
Pratt, Jonathan
Xavier, Agnes Maneesha Dominic Merwin
Ortiz, Gabriel Calderon
Klein, Brianna A.
Armstrong, Andrew
Hwang, Jinwoo
Rajan, Siddharth
Materials Science
We report on the heterostructure and interfacial engineering of metalorganic chemical vapor deposition (MOCVD) grown reverse-graded contacts to ultra-wide bandgap AlGaN. A record low contact resistivity of 1.4 x 10-6 Ohm.cm2 was reported on an Al0.82Ga0.18N metal semiconductor field effect transistor (MESFET) by compositionally grading the contact layer from Al0.85Ga0.15N to Al0.14Ga0.86N with degenerate doping and proper interfacial engineering considering bandgap-narrowing-induced band offset between channel and contact layer. This represents orders-of-magnitude of lower contact resistivity than that obtained in similar MOCVD-grown structures. A detailed, layer-by-layer analysis of the reverse graded contact and TCAD simulation of the bandgap narrowing effect highlighted that the reverse graded contact layer itself is extremely conductive and interfacial resistance due to bandgap-narrowing-induced barrier between contact and channel dominates the contact resistance.
title Heterostructure and Interfacial Engineering for Low-Resistance Contacts to Ultra-Wide Bandgap AlGaN
topic Materials Science
url https://arxiv.org/abs/2411.10566