Zhu, T., Wang, Q., Lin, Y., Wang, R., & Huang, R. (2024). MORE-Stress: Model Order Reduction based Efficient Numerical Algorithm for Thermal Stress Simulation of TSV Arrays in 2.5D/3D IC.
Chicago-Zitierstil (17. Ausg.)Zhu, Tianxiang, Qipan Wang, Yibo Lin, Runsheng Wang, und Ru Huang. MORE-Stress: Model Order Reduction Based Efficient Numerical Algorithm for Thermal Stress Simulation of TSV Arrays in 2.5D/3D IC. 2024.
MLA-Zitierstil (9. Ausg.)Zhu, Tianxiang, et al. MORE-Stress: Model Order Reduction Based Efficient Numerical Algorithm for Thermal Stress Simulation of TSV Arrays in 2.5D/3D IC. 2024.
Achtung: Diese Zitate sind unter Umständen nicht zu 100% korrekt.