APA (7th ed.) Citation

Zhu, T., Wang, Q., Lin, Y., Wang, R., & Huang, R. (2024). MORE-Stress: Model Order Reduction based Efficient Numerical Algorithm for Thermal Stress Simulation of TSV Arrays in 2.5D/3D IC.

Chicago Style (17th ed.) Citation

Zhu, Tianxiang, Qipan Wang, Yibo Lin, Runsheng Wang, and Ru Huang. MORE-Stress: Model Order Reduction Based Efficient Numerical Algorithm for Thermal Stress Simulation of TSV Arrays in 2.5D/3D IC. 2024.

MLA (9th ed.) Citation

Zhu, Tianxiang, et al. MORE-Stress: Model Order Reduction Based Efficient Numerical Algorithm for Thermal Stress Simulation of TSV Arrays in 2.5D/3D IC. 2024.